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封装packageinterface接口 | 家庭/个人应用 2022-08-29 99 0star收藏 版权: . 保留作者信息 . 禁止商业使用 . 禁止修改作品
1×9封装--焊接型光模块,一般速度不高于千兆,多采用SC接口SFF封装--焊接小封装光模块,一般速度不高于千兆,多采用LC接口GBIC封装--热插拔千兆接口光模块,采用SC接口SFP封装--热插拔小封装模块,目前最高数率可达4G,多采用LC接口XENPAK封装--使用在万兆以太网,采用SC接口XFP封装--10G光模块,可用在万兆以太网,SONET等多种系统,多采用LC接口

(1×9 package--welding optical module, the general speed is not higher than gigabit, and SC interface SFF package is mostly used--soldering small package optical module, the general speed is not higher than gigabit, and LC interface GBIC package is mostly used-thermal Plug-in Gigabit interface optical module, using SC interface SFP package -- hot-plug small package module, currently the highest data rate can reach 4G, mostly using LC interface XENPAK package -- used in 10 Gigabit Ethernet, using SC interface XFP package --10G optical module, can be used in 10 Gigabit Ethernet, SONET and other systems, mostly using LC interface)

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