1×9封装--焊接型光模块，一般速度不高于千兆，多采用SC接口SFF封装--焊接小封装光模块，一般速度不高于千兆，多采用LC接口GBIC封装--热插拔千兆接口光模块，采用SC接口SFP封装--热插拔小封装模块，目前最高数率可达4G，多采用LC接口XENPAK封装--使用在万兆以太网，采用SC接口XFP封装--10G光模块，可用在万兆以太网，SONET等多种系统，多采用LC接口

(1×9 package--welding optical module, the general speed is not higher than gigabit, and SC interface SFF package is mostly used--soldering small package optical module, the general speed is not higher than gigabit, and LC interface GBIC package is mostly used-thermal Plug-in Gigabit interface optical module, using SC interface SFP package -- hot-plug small package module, currently the highest data rate can reach 4G, mostly using LC interface XENPAK package -- used in 10 Gigabit Ethernet, using SC interface XFP package --10G optical module, can be used in 10 Gigabit Ethernet, SONET and other systems, mostly using LC interface)

[下载]14292629405.rar

2022-8-29 14:29 上传

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1×9封装--焊接型光模块，一般速度不高于千兆，多采用SC接口SFF封装--焊接小封装光模块，一般速度不高于千兆，多采用LC接口GBIC封装--热插拔千兆接口光模块，采用SC接口SFP封装--热插拔小封装模块，目前最高数率可达4G，多采用LC接口XENPAK封装--使用在万兆以太网，采用SC接口XFP封装--10G光模块，可用在万兆以太网，SONET等多种系统，多采用LC接口

(1×9 package--welding optical module, the general speed is not higher than gigabit, and SC interface SFF package is mostly used--soldering small package optical module, the general speed is not higher than gigabit, and LC interface GBIC package is mostly used-thermal Plug-in Gigabit interface optical module, using SC interface SFP package -- hot-plug small package module, currently the highest data rate can reach 4G, mostly using LC interface XENPAK package -- used in 10 Gigabit Ethernet, using SC interface XFP package --10G optical module, can be used in 10 Gigabit Ethernet, SONET and other systems, mostly using LC interface)

[下载]14292629405.rar

2022-8-29 14:29 上传

文件大小: 1 MB
下载次数: 0